Extended Capabilities

The SEER for Hardware, Electronics & Systems (SEER HW) product line consists of the SEER HW Core (formerly SEER-H) and extended capabilities which can be licensed individually or bundled within a choice of delivery editions.

SEER Integration to MS Project automatically constructs a complete project plan from any SEER for Hardware project estimate. This integration may be used "out-of-the-box" or with customized activity plans and labor categories.

Integrated Circuits Pro simplifies the estimation of development and production costs for custom ICs, ASICs and FPGAs. While the SEER HW core includes functionality to estimate IC costs at the PCB and module level, dramatic increases in cost and complexity of custom components have made it necessary to estimate electronic components at a great level of specificity. SEER for ICs Pro enables electronics specialists to develop accurate and reliable estimates specifying FPGA input variables such as Active I/O Pins per Chip, Clock Speed or Frequency, Active Logic Cells, New Design %, Front and Back-end Complexity, and more. ASIC input variables include Process; Die Area; Feature Size (nanometers); Effective Gates per Die, Logic; Memory, and IP Logic Gates and Complexity; and more than 15 additional parameters.

Electro-optical Sensors Pro (EOS Pro) adds specific features to extend the capability of SEER HW to estimate the life-cycle costs of electro-optical sensors. EOS Pro estimates are derived from the technology options a user selects, as well as the values specified for key technical and performance parameters.